Pb-free solder package is more susceptible to interfacial delamination in Cu/MSQ structures due to a higher reflow temperature but the energy release rate is lower than the Cu/SiLK structure. 0 3 6 9 12 crack 1 crack 2 crack 3 crack 4 crack 5 crack 6 ERR(J/m^2) Eutectic solder package Lead-free solder package Lead Free Reliability and Reliability Testing for RoHS Lead Free Electronics 2007 April 10-11, 2007 Boston, Massachusetts, USA Volume 1 of 2 Printed from e-media with permission by: Fatigue Life Prediction Methodology for Lead Free Solder Alloy Interconnects: Development and Validation Solder interconnect reliability is influenced by the environmental imposed load, solder material properties and the microstructure formed between the solder and the metal surfaces to which the solder is bonded. Several lead-free metallurgies are being used for component terminals, board pad plating and solder materials. manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications • IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability • Made in America in our vertically integrated Lead-Free Solder Testing for High Reliability Lead-Free Solder Testing for High Reliability POC: K. Kessel, NASA TEERM Principal Center (321-867-8480) kurt.r.kessel@nasa.gov Background Solder materials used in assemblies pervade many forms of electronic platforms used by the DoD and NASA. This paper reviews the research progress on solder joint reliability of lead-free solder joints, discusses the impact of temperature, vibration, tin whisker and electromigration on solder joint reliability, and pro- vides a further theoretical basis for the study of solder joint reliability of electronic products in service. 2. This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed. where solder is often used as a die-attach in solder paste or wire form. The high melting point helps the solder withstand the operational temperatures associated with engine compartment electronics [2], such as in applications where Indalloy® 151 (92.5Pb/5Sn/2.5Ag) is commonly used. Another advantage of using indium-lead alloys is their Digital Integrated Circuits Interconnect © Prentice Hall 1995 Tape-Automated Bonding (TAB) (a) Polymer Tape with imprinted (b) Die attachment using solder bumps. Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met. Table of Contents GO TO PART The reliability of solder joints can be affected by a variety of application conditions such as vibration, mechanical shock, thermo-mechanical fatigue, thermal aging and humidity (Lechovic et al, 2009). McCluskey (2010) and Cuddalorepatta et al (2010)reported that the soldered interconnect joint is the most susceptible part of the assembly. This study focused on the board level solder joint reliability of a 28 lead dual row QFN pac